The standard, titled "Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance," provides the international specifications for press-in technology used in electronics manufacturing.
Allows for very close spacing of pins, essential for modern high-speed connectors.
The maximum force allowed to push the pin into the board without damaging the assembly.
The standard provides a means of comparing test results even when the tools used to make the connections are of different designs or manufacture. This is invaluable when you have multiple assembly lines or contract manufacturers; you can verify that all produce equivalent quality.
Specifications for the pins, the plated-through holes, and the finished assembly. iec 60352-5 pdf
#Engineering #Electronics #IECStandards #Manufacturing #PCBDesign #PressFit summary of the specific test schedules (Qualification vs. Application) outlined in the standard? IEC 60352-5:2020 - iTeh Standards
The standard specifies requirements, test procedures, and practical guidance to ensure that press-fit connections remain electrically stable and mechanically sound under various environmental conditions.
: IEC 60352-5 details a series of tests and inspection procedures to verify that solderless connections meet the specified requirements. These tests include type tests, routine tests, and sample tests.
: Detailed requirements for the plated-through holes (PTH) on the board, including copper thickness limits and hole diameters. The standard, titled "Solderless connections - Part 5:
: Updated copper thickness limits for plated-through holes to match current market manufacturing practices. iTeh Standards For official access, you can find the full document on the IEC Webstore or through regional standards bodies like BSI Knowledge environmental aging sequences defined in the standard?
Industry measurements show that a properly qualified press‑fit pin can achieve a contact resistance as low as after environmental conditioning, well below the typical automotive design requirement of 0.5 mΩ . This level of performance confirms that press‑in technology is not just convenient but also electrically superior for many applications.
Manufacturers, quality engineers, and PCB assemblers use IEC 60352-5 to validate that press-fit technology meets safety and performance benchmarks.
: Used to prove the fundamental suitability of a specific press-in zone design, independent of its final application. Application Test Schedule The standard provides a means of comparing test
: It now covers a broader range of "electrical and electronic equipment" rather than just telecommunications.
These pins do not deform significantly during insertion. Instead, the deformation occurs almost entirely within the PCB's plated-through hole. Because they risk damaging the board, rigid pins are less common in modern, high-density PCBs.
The primary goal is to ensure electrically stable and mechanically sound connections under prescribed environmental conditions.
The IEC 60352 series consists of several parts, each devoted to a different solderless connection technology. Understanding the differences helps you select the correct standard for your application.
is an internationally recognized standard published by the International Electrotechnical Commission (IEC). Its full title is "Solderless connections – Part 5: Press-in connections" .