specifications, serving as a high-speed successor to the older eMMC parallel interface. samsung.com Technical Specifications Summary Package Type Ball Grid Array (BGA) with 254 pins MIPI M-PHY (High-speed serial) Data Transfer Rates Up to 5.8 Gbit/s per lane (Full-duplex serial LVDS) Physical Dimensions Standard 11.5mm x 13.0mm Voltage Requirements cap V sub cap C cap C end-sub (2.7V–3.6V) and cap V sub cap C cap C cap Q end-sub (1.7V–1.95V) Operating Temp -40°C to +105°C (Automotive/Industrial grade) Key Hardware Characteristics Power Sequencing
Because MIPI M-PHY operates at multi-gigabit speeds, strict signal integrity practices must be followed during layout.
Power supply pins (typically 2.5V/3.3V for VCC and 1.2V/1.8V for VCCQ).
For hardware engineering and ISP (In-System Programming) operations, the following pin assignments are essential: Ufs Bga 254 Datasheet
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Autonomous driving and Advanced Driver Assistance Systems (ADAS) High-end tablets and ultra-portable laptops Next-generation VR/AR headsets 2. Technical Specifications & Performance Evolution
The "UFS BGA 254 Datasheet" appears to refer to a specific type of semiconductor packaging used for Universal Flash Storage (UFS) memory chips. UFS is a type of non-volatile memory used in many modern devices, including smartphones, tablets, and other mobile electronics. BGA (Ball Grid Array) 254 refers to the packaging type and the number of pins or balls on the package. specifications, serving as a high-speed successor to the
Universal Flash Storage (UFS) has superseded eMMC as the definitive storage standard for modern high-performance mobile devices, automotive systems, and IoT gateways. Among the various form factors, the package is highly prevalent, blending high-density flash storage with an integrated controller into a single 254-ball grid array.
Need a specific UFS BGA 254 datasheet? Contact the manufacturer’s FAE with your project details and target temperature range. They may provide additional simulation models (IBIS/BSDL) not included in the public datasheet.
I/O supply voltages for the controller and high-speed lanes. UFS is a type of non-volatile memory used
0.5 mm (The distance between the centers of adjacent solder balls). Ball Matrix:
IO supply for the host interface controller (typically 1.14V to 1.30V).